Semiconductor giant TSMC has reportedly completed the tape-out for Google’s next-generation Tensor System on Chip (SoC) for Pixel phones using its cutting-edge 3nm process technology. This move marks a major blow for Google’s current foundry partner Samsung, which has been suffering from growing problems in its semiconductor manufacturing business.
The tape-out process involves finalizing the design and layout of a chip before it enters mass production. By successfully completing this step, TSMC and Google are one step closer to bringing the next-generation Tensor SoC to market. The new chip is expected to power upcoming Google Pixel devices, offering significant improvements in computational power, energy efficiency, and overall performance.
TSMC’s 3nm process technology is a key factor in this shift and has already been adopted by Apple, Qualcomm, and MediaTek. The 3nm node represents one of the most advanced manufacturing technologies in the semiconductor industry, enabling higher transistor density, improved power efficiency, and more complex and powerful chip designs. This in turn can lead to better performance and longer battery life for consumer electronics devices such as smartphones.
By leveraging TSMC’s expertise in advanced semiconductor processes, Google aims to boost the competitiveness of its future Pixel smartphones against tough competition from Apple, Samsung, Xiaomi, Oppo, and other leading Chinese vendors.
Long time technology industry fan here in Taiwan.
