MediaTek has announced two new 4nm chips, the Dimensity 7300 and Dimensity 7300X, for AI-capable smartphones. With its dual-display support, the Dimensity 7300X is designed for foldable devices.
Both MediaTek Dimensity 7300 series chips feature an octa-core CPU comprising four Arm Cortex-A78 cores that run up to 2.5GHz and four Arm Cortex-A55 cores. The CPU is paired with the latest Arm Mali-G615 GPU, complemented by MediaTek’s HyperEngine optimizations, which collectively boost gaming performance. According to MediaTek, the Dimensity 7300 series boasts a 20% increase in frames per second (FPS) and a 20% improvement in energy efficiency over comparable chips from competitors.
Other key features include MediaTek Imagiq 950, a 12-bit HDR-ISP that supports a 200MP main camera and offers precise noise reduction, face detection, and video HDR, and a powerful new APU (Accelerated Processing Unit) that delivers twice the performance of the Dimensity 7050 for AI workloads. Support for high-resolution WFHD+ displays with 10-bit true color and global HDR standards ensures exceptional media streaming and playback quality according to the company.
Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business, commented that the new Dimensity 7300 series chips “will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game.” He also noted that the Dimensity 7300X’s dual display support further will OEMs to innovate with new device form factors.
The Dimensity 7300 and 7300X include MediaTek 5G UltraSave 3.0+ technology, which incorporates R16 power-saving enhancements and proprietary optimizations, offering up to 30% greater power efficiency in common 5G sub-6GHz scenarios. The chips support up to 3.27Gb/s 5G downlink speeds through 3CC carrier aggregation, tri-band Wi-Fi 6E for reliable multi-gigabit connectivity, and dual 5G SIM support with dual VoNR.
You can learn more about MediaTek’s complete Dimensity portfolio here
